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embedded usb mass storage drive (e230) mtedcar002saj-1m2/1m2it, mtedcar004saj-1n2/1n2it mtedcar008saj-1n2/1n2it, mtedcar016saj-1n2/1n2it mtedcbr002saj-1m2/1m2it, mtedcbr004saj-1n2/1n2it mtedcbr008saj-1n2/1n2it, mtedcbr016saj-1n2/1n2it mtedcbe002saj-1m2/1m2it, mtedcbe004saj-1n2/1n2it mtedcbe008saj-1n2/1n2it, mtedcbe016saj-1n2/1n2it MTEDCAE002SAJ-1m2/1m2it, mtedcae004saj-1n2/1n2it mtedcae008saj-1n2/1n2it, mtedcae016saj-1n2/1n2it features ? micron ? nand flash ? interface: universal serial bus (usb) specification, revision 2.0 ? usb support C usb specification, revisions 2.0, 1.1 C usb mass storage class specification, revision 1.0 ? performance C sequential read 1 : 30 mb/s C sequential write 1 : 22 mb/s (2gb and 4gb); 28 mb/s (8gb and16gb) ? reliability: >1 million device hours mean time be- tween failure (mtbf) ? endurance: useful operating life of at least 5 years under the following conditions: C 8760 power-on hours per year C active 100% of power-on hours C typical operating conditions 2 : 2gb module: 16 gb/day; 4gb module: 32 gb/day; 8gb module: 64 gb/day; 16gb module: 128 gb/day ? static and dynamic wear-leveling ? 15-bit error correction code (ecc) ? reliability reporting ? capacity (unformatted) 3 : 2gb, 4gb, 8gb, or 16gb ? form factor C standard (36.9mm x 26.6mm x 9.6mm) C low profile (36.9mm x 26.6mm x 5.8mm) ? voltage: 5v 5% and 3.3v 5% ? operating temperature C commercial (0c to +70c) C industrial (C40c to +85c) notes: 1. typical transfer rate measured with h2bench 3.6. 2. assumes that 70% of total usable drive ca- pacity contains static files. 3. 1gb = 1 billion bytes; formatted capacity is less. warranty : contact your micron sales representative for further information regarding the product, including product warranties. embedded usb mass storage drive (e230) features pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 1 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved. products and specifications discussed herein are subject to change by micron without notice.
part numbering information microns embedded usb drives are available in different configurations and densities. visit www.micron.com for a list of valid part numbers. table 1: part number example part number category micron tech- nology product family drive inter- face drive form factor drive density nand flash type product family sector size nand compo- nent revi- sion operat- ing temper- ature range produc- tion status mt ed c ae 002 s aj -1 m 1 it es table 2: part number information scheme part number category category details micron technology micron technology product family ed = embedded drive drive interface c = usb 2.0 drive form factor ae = embedded usb: 5v standard profile (36.9mm x 26.6mm x 9.6mm) be = embedded usb: 5v low profile (36.9mm x 26.6mm x 5.8mm) ar = embedded usb: 3v standard profile (36.9mm x 26.6mm x 9.6mm) br = embedded usb: 3v low profile (36.9mm x 26.6mm x 5.8mm) drive density 002 = 2gb 004 = 4gb 008 = 8gb 016 = 16gb nand flash type s = slc product family aj = option j sector size 1 = 512-byte nand component m = 8gb; x8; 3.3v n = 16gb; x8; 3.3v revision 1 = first generation 2 = second generation 3 = third generation operating tempera- ture range blank = commercial (0c to 70c) it = industrial (40c to 85c) production status blank = production es = engineering sample ms = mechanical sample embedded usb mass storage drive (e230) features pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 2 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
general description micron embedded universal serial bus (usb) mass storage drives provide 2gb, 4gb, 8gb, or 16gb of usb 2.0-compatible memory storage in a small form factor. the em- bedded usb drive is an ideal solution for applications that require low cost and high re- liability. typical applications include pc caching and boot drives for embedded com- puting, server, and networking systems. high performance, reliability, and easy implementation make micron embedded usbs an ideal storage solution. to consistently deliver the best possible performance, the em- bedded usb uses only slc nand flash, and all densities use two x8 nand channels to the controller. in addition to being fast, slc nand flash offers solid reliability, coupled with ecc and wear leveling. the usb system interface is widely available in many sys- tem designs and is easy to implement, enabling rapid time to market. the embedded usb consists of two tsop-packaged micron nand flash components, a usb controller, and a 10-pin usb connector on a pcb. different densities are available depending on the number of die in each package and the density of each nand flash die. the drive operates at 5v 5% or 3.3v 5%. it uses industry-standard 10-pin connec- tors and supports usb specification, revision 2.0. it is also backward compatible with revision 1.1 and can be used with operating systems that support usb mass storage class specification, revision 1.0. figure 1: functional block diagram usb controller channel 1 channel 1 channel 2 nand data bus nand data bus nand command usb connector micron nand flash micron nand flash usb protocol table 3: nominal package dimensions, density, and weight value unit height 9.6 (standard) 5.8 (low profile) mm width 26.6 mm length 36.9 mm density 2, 4, 8, 16 gb unit weight 4.5 g embedded usb mass storage drive (e230) general description pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 3 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
figure 2: pin assignments: 2 x 5 connector key gnd usb usb vcc data data (+5v) (+) (C) nc nc nc nc nc 10 8 6 4 2 9 7 5 3 1 top view (through pcb) bottom view vcc usb usb gnd key (+5v) data data (C) (+) nc nc nc nc nc 2 4 6 8 10 1 3 5 7 9 note: 1. diagram not to scale. table 4: signal/pin descriptions symbol type function usb data (+), usb data (C) i/o data inputs/outputs : the bidirection- al i/os transfer address, data, and in- struction information. data is output only during read operations; at other times the i/os are inputs. v cc supply v cc power supply pin. v ss supply v ss ground connection nc C no connect : nc pins are not internally connected. these pins can be driven or left floating. key C this pin is keyed. embedded usb mass storage drive (e230) general description pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 4 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
error management the embedded usb incorporates advanced technology for defect and error manage- ment. it uses various combinations of hardware-based error correction algorithms and firmware-based wear-leveling algorithms. over the life of the drive, uncorrectable errors may occur. an uncorrectable error is de- fined as data that is reported as successfully programmed to the drive, but when it is read out of the drive, the data differs from what was programmed. see the uncorrecta- ble bit error rate table. the mean time between failures (mtbf) can be predicted based on component reliabil- ity data obtained by following the methods referenced in the telecordia sr-332 reliabili- ty prediction procedures for electronic equipment. table 5: system reliability density mtfb (operating hours) 2C16gb >1 million device hours table 6: uncorrectable bit error rate uncorrectable bit error rate (ber) 1 operation <1 bit error in 10 15 bits read note: 1. ber is measured with a write-to-read ratio of 1:1. wear-leveling algorithm the controller adds a built-in ram register unit to record the erase count of each block. accordingly, the controller can decide the frequency of wear leveling and choose the proper blocks to swap. this technique successfully averages the erase count of the data blocks. also, an enhanced wear leveling algorithm now includes most static blocks in the recycling pool. increasing the number of blocks makes the wear-leveling algorithm more robust, and in turn extends product life. embedded usb mass storage drive (e230) error management pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 5 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
electrical characteristics stresses greater than those listed may cause permanent damage to the drive. this is a stress rating only, and functional operation of the drive at these or any other conditions above those indicated in the operational sections of this specification is not implied. ex- posure to absolute maximum rating conditions for extended periods may affect reliabil- ity. table 7: absolute maximum ratings parameter/condition symbol min max unit v cc supply voltage v cc C0.6 5.25 v table 8: dc and operating characteristics parameter/condition symbol min typ max unit condition standby current isb C 60 70 ma v cc = 3v C 50 60 ma v cc = 5v active current i cc 1 C 100 120 ma v cc = 3v /5v table 9: recommended operating conditions parameter/condition symbol min typ max unit operating temperature commercial t a 0 C 70 c industrial C40 C 85 c v cc supply voltage 5v v cc 4.75 5.00 5.25 v 3.3v v cc 2.85 3.3 3.5 v ground supply voltage v ss 0 0 0 v table 10: shock and vibration parameter/condition specification shock 1500g/0.5ms vibration 5C500hz at 3.1g embedded usb mass storage drive (e230) electrical characteristics pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 6 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
compliance micron embedded usb drives comply with the following requirements: ? ce (europe): en55022, 2006 class b and en55024, 1998 + a1: 2001 + a2:2003 ? fcc: cfr title 47, part 15, ices-003, all class b ? ul (us): approval to ul-60950-1, 2nd edition, 2007-03-27, iec 60950-1:2005, 2nd ed- ition ? rohs, green package configuration the following configuration options are available: ? micron's embedded usb drive can be configured as a boot drive. ? the standard fix configuration should be mounted as local drive. note: the embedded usb drive cannot be configured as a removable drive. embedded usb mass storage drive (e230) compliance pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 7 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
mechanical information the standard 10-pin (2 x 5) female electrical connector has a height of 7.4mm and a pitch of 2.54mm. it supports the standard usb 2.0 interface. the low profile 10-pin (2 x 5) female electrical connector has a height of 3.6mm and a pitch of 2.0mm. it supports the standard usb 2.0 interface. a mounting hole is also provided on the pcb for a sta- ble, reliable connection to the mounting board. the motherboard pin headers listed in table 9 are compatible with microns embedded usb drives. pin headers that are not listed may also be compatible. table 11: compatible pin headers manufacturer profile part number type pinrex standard 212-92-05gb01 smt 210-92-05gb01 straight amtek standard phifs25-205gb press fit phis25-205gb straight samtec low profile tmm-105-01-s-d-02 straight reference documents reference documentation for the usb 2.0 standard (usb 2.0 specification, technical documents, compliance test procedures, and other related documents) can be found at www.usb.org/developers/docs. embedded usb mass storage drive (e230) mechanical information pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 8 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
package dimensions figure 3: embedded usb package, standard profile 3x ?2.03 ?3.2 2.87 4.9 2.95 2.45 1.1 1 7.5 1.6 9.6 0.1 2.54 2.54 20.7 0.25 36.9 0.25 31.16 0.25 25 0.25 27.5 0.25 26.6 0.25 20.7 0.25 note: 1. all dimensions are in millimeters. embedded usb mass storage drive (e230) package dimensions pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 9 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
figure 4: embedded usb package, low profile 3x ?2.03 ?3.2 2.87 4.9 2.95 2.45 1.2 1 3.6 1.6 5.8 0.1 2.0 2.0 20.7 0.25 36.9 0.25 31.16 0.25 25 0.25 27.5 0.25 26.6 0.25 20.7 0.25 note: 1. all dimensions are in millimeters. embedded usb mass storage drive (e230) package dimensions pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 10 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.
revision history rev. d C 4/13 ? updated the package drawing ? updated densities in order information rev. c, advance C 7/12 ? added 3v information to dc and operating conditions table rev. b, advance C 9/11 ? added low profile and 3v information rev. a, advance C 4/11 ? initial release 8000 s. federal way, p.o. box 6, boise, id 83707-0006, tel: 208-368-3900 www.micron.com/productsupport customer comment line: 800-932-4992 micron and the micron logo are trademarks of micron technology, inc. all other trademarks are the property of their respective owners. this data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. although considered final, these specifications are subject to change, as further product development and data characterization some- times occur. embedded usb mass storage drive (e230) revision history pdf: 09005aef84970b4f eusb_mted_230_embedded.pdf - rev. d 4/13 en 11 micron technology, inc. reserves the right to change products or specifications without notice. ? 2011 micron technology, inc. all rights reserved.

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